cystech electronics corp. spec. no. : c145a3 issued date : 2017.03.28 revised date : page no. : 1/8 btna29a3 cystek product specification general purpose npn epitaxial planar transistor btna29a3 description ? the btna29a3 is a darlington amplifier transistor ? pb-free lead plating and halogen-free packa ge symbol outline btna29a3 to-92 ordering information device package shipping btna29a3-0-tb-g to-92 (pb-free lead plating and halogen-free package) 2000 pcs / tape & box BTNA29A3-0-BK-G to-92 (pb-free lead plating and halogen-free package) 1000 pcs/ bag, 10 bags/box, 10boxes/carton b base e c b c collector e b c e emitter environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, tb :2000 pcs/tape & box; bk: 1000 pcs / bag, 10 bags/box, 10 boxes/carton product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c145a3 issued date : 2017.03.28 revised date : page no. : 2/8 btna29a3 cystek product specification absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo 100 v collector-emitter voltage v ces 100 v emitter-base voltage v ebo 12 v collector current i c 0.5 a power dissipation p d 625 mw operating junction temperature range tj -55~+150 c storage temperature range tstg -55~+150 c maximum ratings are those values beyond whic h device damage can occur. maximum rati ngs applied to the device are individual st ress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device function al operation is not implied, damage may occur and reliability may be affected. thermal data parameter symbol value unit thermal resistance, junction-to-case, max r jc 83.3 thermal resistance, junction-to-ambient, max r ja 200 c/w characteristics (ta=25c) symbol min. typ. max. unit test conditions bv cbo 100 - - v i c =100 a bv ces 100 - - v i c =100 a, v be =0v bv ebo 12 - - v i e =10 a i cbo - - 100 na v cb =80v i ces - - 500 na v ce =80v i ebo - - 100 na v eb =10v *v ce(sat) - 0.71 1.2 v i c =10ma, i b =0.01ma *v ce(sat) - 0.84 1.5 v i c =100ma, i b =0.1ma *v be(on) - 1.35 2.0 v v ce =5v, i c =100ma *h fe 1 10k - - v ce =5v, i c =10ma *h fe 2 10k - - v ce =5v, i c =100ma ft 125 200 - mhz v ce =5v, i c =10ma, f=100mhz cob - 5 8 pf v cb =10v, f=100mhz *pulse test: pulse width 300 s, duty cycle 2%
cystech electronics corp. spec. no. : c145a3 issued date : 2017.03.28 revised date : page no. : 3/8 btna29a3 cystek product specification typical characteristics emitter grounded output characteristics 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0123456 vce, collector-to-emitter voltage(v) ic, collector current(a) ib=0 ib=1ma ib=100ua emitter grounded output characteristics 0 0.2 0.4 0.6 0.8 1 1.2 0123456 vce, collector-to-emitter voltage(v) ic, collector current(a) ib = 0 ib=500ua ib=5ma emitter grounded output characteristics 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0123456 vce, collector-to-emitter voltage(v) ic, collector current(a) ib=0 ib=2ma ib=4ma ib=10ma ib=20ma emitter grounded output characteristics 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0123456 vce, collector-to-emitter voltage(v) ic, collector current(a) ib=0 ib=5ma ib=10ma ib=50m a current gain vs collector current 1 10 100 1 10 100 1000 ic, collector current(ma) hfe, current gain ta=25c vce=10v vce=5v vce=2v current gain vs collector current 1 10 100 1000 1 10 100 1000 ic, collector current(ma) hfe, current gain vce=5v 125c 75c 25c 0c -40c
cystech electronics corp. spec. no. : c145a3 issued date : 2017.03.28 revised date : page no. : 4/8 btna29a3 cystek product specification typical characteristics(cont.) current gain vs collector current 1 10 100 1000 1 10 100 1000 ic, collector current(ma) hfe, current gain vce=10v 125c 75c 25c 0c -40c saturation voltage vs collector current 100 1000 10000 1 10 100 1000 ic, collector current(ma) vce(sat), saturation voltage(mv) vce(sat) @ ic=500ib -40c 0c 25c 75c 125c saturation voltage vs collector current 100 1000 10000 1 10 100 1000 ic, collector current(ma) vce(sat), saturation voltage(mv) vce(sat) @ ic=1000ib -40c 0c 25c 75c 125c saturation voltage vs collector current 100 1000 10000 1 10 100 1000 ic, collector current(ma) vbe(sat), saturation voltage(mv) vbe(sat)@ic=500ib -40c 0c 25c 75c 125c saturation voltage vs collector current 100 1000 10000 1 10 100 1000 ic, collector current(ma) vbe(sat), saturation voltage(mv) vbe(sat)@ic=1000ib -40c 0c 25c 75c 125c saturation voltage vs collector current 100 1000 10000 1 10 100 1000 ic, collector current(ma) vbe(on), o n voltage(mv) vbe(on)@vce=5v -40c 0c 25c 75c 125c
cystech electronics corp. spec. no. : c145a3 issued date : 2017.03.28 revised date : page no. : 5/8 btna29a3 cystek product specification typical characteristics(cont.) capacitance vs reverse-biased voltage 1 10 100 0.1 1 10 100 vr, reverse-biased voltage(v) capacitance(pf) cob cib power derating curve 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 50 100 150 200 ta, ambient temperature() pd, power dissipation(w)
cystech electronics corp. spec. no. : c145a3 issued date : 2017.03.28 revised date : page no. : 6/8 btna29a3 cystek product specification to-92 taping outline millimeters dim item min. max. a component body height 4.33 4.83 d tape feed diameter 3.80 4.20 d1 h2a h2a h2 h2 d2 a h w w1 h3 h4 h1 l1 l p2 p p1 f1 f2 d1 d t2 t t1 lead diameter 0.36 0.53 d2 component body diameter 4.33 4.83 f1,f2 component lead pitch 2.40 2.90 f1,f2 f1-f2 - 0.3 h height of seating plane 15.50 16.50 h1 feed hole location 8.50 9.50 h2 front to rear deflection - 1 h2a deflection left or right - 1 h3 component height - 27 h4 feed hole to bottom of component - 21 l lead length after component removal - 11 l1 lead wire enclosure 2.50 - p feed hole pitch 12.50 12.90 p1 center of seating plane location 5.95 6.75 p2 4 feed hole pitch 50.30 51.30 t over all tape thickness - 0.55 t1 total taped package thickness - 1.42 t2 carrier tape thickness 0.36 0.68 w tape width 17.50 19.00 w1 adhesive tape width 5.00 7.00 - 20 pcs pitch 253 255
cystech electronics corp. spec. no. : c145a3 issued date : 2017.03.28 revised date : page no. : 7/8 btna29a3 cystek product specification recommended wave soldering condition soldering time product peak temperature pb-free devices 5 +1/-1 seconds 260 +0/-5 c recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 217 c 60-150 seconds 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of the package, measured on the package body surface.
revised date : page no. : 8/8 cystech electronics corp. spec. no. : c145a3 issued date : 2017.03.28 btna29a3 cystek product specification to-92 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1704 0.1902 4.33 4.83 g 0.0142 0.0220 0.36 0.56 b 0.1704 0.1902 4.33 4.83 h - * 0.1000 - * 2.54 c 0.5000 - 12.70 - i - * 0.0500 - * 1.27 d 0.0142 0.0220 0.36 0.56 1 - * 5 - * 5 e - * 0.0500 - * 1.27 2 - * 2 - * 2 f 0.1323 0.1480 3.36 3.76 3 - * 2 - * 2 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . n a29 marking: 3 1 a d b c i 1 e f 2 2 3 date code g h s t yle: pin 1.emitter 2.base 3.collector 3-lead t o -92 plastic package cy s t ek p a cka g e code: a 3
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